MILWAUKEE – October 16, 2024 – Rockwell Automation, Inc. (NYSE: ROK), the world’s largest company dedicated to industrial automation and digital transformation, will showcase a complete Connected Enterprise® demonstration at PACK EXPO International 2024, taking place November 3-6 in Chicago. A Connected Enterprise converges plant-level and enterprise networks to securely connect people, processes, and technologies — allowing users to act on production data, enable faster time-to-value, and optimize manufacturing operations. Across the packaged goods landscape, connected and digitally optimized processes can help leaders overcome critical industry challenges.
“We are thrilled to be part of PACK EXPO 2024 and to showcase the many ways we help manufacturing leaders navigate a complex and evolving landscape,” said Steve Deitzer, vice president of global industry, CPG, Rockwell Automation. “Attendees will discover how the convergence of flexible equipment and cutting-edge digital solutions are enabling manufacturers to optimize and transform their operations. From the Rockwell booth and OEM technology showcase to thought leadership sessions and more than 85 partner exhibits across the show floor, attendees will be sure to experience all that Rockwell has to offer at this year’s PACK EXPO International.”
Attendees who visit Rockwell's booth (S-1544) can experience dynamic solutions and interactive demonstrations through a Connected Enterprise.
- Industrial AI: Optimize manufacturing operations and increase productivity with the latest AI solutions on display. These solutions include FactoryTalk® Analytics™ LogixAI® for filling accuracy, as well as FactoryTalk® Design Studio™ Copilot that uses Generative AI to process natural language to create PLC code.
- DataReady™ smart machines: Harness the power of machine insights through Rockwell’s FactoryTalk® Optix™ and Plex Asset Performance Management demos supporting visualization at the machine level, enabling data egress and empowering users with insights for real-time decision-making.
- Intelligent material movement: Discover how autonomous mobile robots (AMRs) and software from OTTO by Rockwell Automation helps manufacturers tackle workforce safety, scale their business, and increase productivity. Attendees can see a live demonstration of OTTO 100, the smallest AMR capable of moving payloads up to 150 kg (331 lbs.). The OTTO 100 will be equipped with a staging cart and autonomously deliver snacks to attendees.
- Digital engineering: Attendees can immerse themselves in a digital world of interactive automation in this virtual reality experience, powered by Emulate3D™ software. Experience being the human element in a semi-automated packaging operation and explore diverse use cases and success stories.
Complementary to its booth, Rockwell’s flexible solutions will also be on display in its OEM technology showcase room. Located off the show floor in Room #S-504, this showcase will display ArmorKinetix® Distributed Servo Drives and iTRAK® Independent Cart Technology in action. These modular, decentralized designs let users do more with less.
PartnerNetwork
Rockwell’s presence at PACK EXPO International will not be limited to its own booth and OEM showcase room. Many booths around the show floor will feature Rockwell technologies and solutions, as most exhibitors are members of the company’s PartnerNetwork. Additionally, more than 60 of Rockwell’s OEM partners will be exhibiting at the show.
Educational Sessions
Those who are interested in learning about the latest trends and solutions in packaging should attend Rockwell’s thought leadership educational sessions on the Innovation Stage at PACK EXPO International. Rockwell's leaders will be presenting on topics including new capacity design, real-life applications for industrial AI, and the role of AMRs in improving worker safety. Learn more about the topics and schedule here.
In addition to exhibiting and hosting educational sessions at PACK EXPO International, Rockwell is supporting scholarships for future packaging professionals by returning as the title sponsor of PACK EXPO’s annual PACK gives BACK event. This year's event will be a reception and comedy performance, Laugh & Give Back: A Night With Nate Bargatze! All proceeds will benefit the PMMI Foundation.
Visit the Rockwell booth at PACK EXPO International to discover connected, end-to-end packaging and processing solutions. For more information, please click here.
